NenoVision fabricate an unique Atomic Force Microscope (AFM) LiteScope™ designed for easy integration into various Scanning Electron Microscopes (SEM), allowing in-situ collerative characterization of the sample in the nanoscale.
Our task was to adapt the LeiteScope™ electronics design and PCB design to Ultra High Vacuum (UHV).
For vacuum electronics, high criteria are placed on the materials of the individual components with respect to parameters such as TML (Total Mass Loss), RML (Recovered Mass Loss), CVCM (Collected Volatile Condensable Material) and WVR (Water Vapor Recovered).
The electronics themselves must be able to withstand the effects of microscope’s thermal preparation procedures, or to operate in an environment at extremely low temperatures and in a space saturated with electrons from the Scanning Electron Microscope (SEM).
The requirements for the development of electronics were further based on high criteria resulting from the application requirements of the atomic force microscope itself, which measures the topography of samples in the nanoscale at high resolution and therefore requires large amplification of electrical signals to maintain low noise.
The selection of materials we used was preceded by research and testing of suitable materials under ultra high vacuum and, last but not least, based on the experience NenoVision scientists. All materials we used in the production of printed circuit boards, including all components, were tested using the RGA (Residual gas analysis) test and passed a strict selection according to NASA specifications.
Thanks to unique and precise technical solutions, we have enabled the creation of a unique atomic force microscope with unique and precise electronics suitable for ultra-high vacuum.
Ground loop control
Precise signals control
Precise layout for noise reduction
UHV compliant material
Compression of components to reduce dimensions
Compact design 21 x 56 x 8 mm
Cost management design
Selective signals control
Compact design 17 x 22 x 2,5 mm
UHV compliant material
Ground loop control
Precise signals control
Precise layout for noise reduction
UHV compliant material
Compression of components to reduce dimensions
Compact design 21 x 56 x 8 mm
Cost management design
Selective signals control
Compact design 17 x 22 x 2,5 mm
UHV compliant material
ALL RIGHTS RESERVED
Bank connection
CZ7961000000001016845862
ALL RIGHTS RESERVED
ALL RIGHTS RESERVED
Bank connection
CZ7961000000001016845862